US Patent Issued to TDK on June 9 for "Thin film capacitor and electronic circuit substrate having the same" (Japanese Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,651,713, issued on June 9, was assigned to TDK Corp. (Tokyo).

"Thin film capacitor and electronic circuit substrate having the same" was invented by Daiki Ishii (Tokyo), Yoshihiko Yano (Tokyo), Yuki Yamashita (Tokyo), Kenichi Yoshida (Tokyo) and Tetsuhiro Takahashi (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "To provide a thin film capacitor having high flexibility. A thin film capacitor includes: a metal foil having a roughened upper surface; a dielectric film covering the upper surface of the metal foil and having an opening through which the metal foil is partly exposed; a first electrode layer contacting the metal foil through the opening; a...