US Patent Issued to TDK on July 14 for "Electronic component structure with multilayer connection portion" (Japanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,683,081, issued on July 14, was assigned to TDK Corp. (Tokyo).

"Electronic component structure with multilayer connection portion" was invented by Toshihiro Iguchi (Tokyo) and Tomohisa Fukuoka (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic component structure includes: a first electronic component; a second electronic component; a low melting point layer located between the first electronic component and the second electronic component and containing a first metal material having a melting point of 300deg C. or lower; and a high melting point layer located between the first electronic component and the second electronic component an...