US Patent Issued to TDK on July 14 for "Electronic component embedded substrate and manufacturing method therefor" (Japanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,684,688, issued on July 14, was assigned to TDK Corp. (Tokyo).

"Electronic component embedded substrate and manufacturing method therefor" was invented by Kazutoshi Tsuyutani (Tokyo), Naoyuki Ishikawa (Tokyo), Takuro Aoki (Tokyo) and Reo Hanada (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "To enhance the degree of design freedom of an outermost conductor layer in an electronic component embedded substrate. An electronic component embedded substrate includes conductor layers, insulating layers each of which is positioned between adjacent two of the conductor layers, and an electronic component embedded in the insulating layer. The conductor layer...