ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,552,124, issued on Feb. 17, was assigned to TDK Corp. (Tokyo).
"Substrate processing apparatus" was invented by Yohei Sato (Tokyo), Osamu Shindo (Tokyo), Hiroshi Koizumi (Tokyo), Makoto Yamashita (Tokyo), Yasuo Kato (Tokyo), Mitsuyoshi Makida (Tokyo) and Masashi Matsumoto (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a substrate processing apparatus capable applying a uniform load to an object to be pressurized. The substrate processing apparatus includes a lower jig plate 46 for arranging a substrate 2 which is an object to be pressurized, an upper jig plate 44 applying pressure to the substrate 2 arranged to the lower jig plate 46,...