ALEXANDRIA, Va., April 21 -- United States Patent no. 12,606,431, issued on April 21, was assigned to TDK Corp. (Tokyo).
"MEMS sensor package and its manufacturing method" was invented by Toyotaka Kobayashi (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed herein is a MEMS sensor package that includes a substrate, an annular-shaped first dry film pattern stuck to one surface of the substrate, and a MEMS sensor chip including a tubular support and a detection part which is supported on the support so as to overlap a cavity of the support. The MEMS sensor chip is fixed to the substrate by sticking an annular mounting surface of the support to the first dry film pattern."
The patent was filed on ...