ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,560,489, issued on Feb. 24, was assigned to TDK Electronics AG (Munich).

"Sensor arrangement and method for producing a sensor arrangement" was invented by Abraham Kho (Singapore), Guido Mauthe (Kepulauan Riau, Indonesia) and Andi Permana (Kepri, Indonesia).

According to the abstract* released by the U.S. Patent & Trademark Office: "In an embodiment a sensor arrangement includes a ceramic-based substrate, at least one sensor chip connected directly to the substrate in a horizontal position by a bonding material, at least one first contact element and at least one second contact element configured to act as outer electrodes of the sensor arrangement, wherein the first contact element ...