ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,167, issued on Aug. 25, was assigned to TDK ELECTRONICS AG (Munich).
"Cooling system" was invented by Markus Koini (Seiersberg, Austria), Markus Puff (Graz, Austria), Jan Ihle (Raaba-Grambach, Austria) and Nele Reimer (Graz, Austria).
According to the abstract* released by the U.S. Patent & Trademark Office: "A cooling system for a semiconductor device. The system includes a first heat sink containing a ceramic material as a main component and a semiconductor device having a first contact surface. The first heat sink serves for cooling the semiconductor device and as an electrical insulator with respect to the semiconductor device. Furthermore, a first metal-containing layer is p...