US Patent Issued to TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY on March 31 for "Substrate, manufacturing method thereof, and spliced panel" (Chinese Inventor)

ALEXANDRIA, Va., March 31 -- United States Patent no. 12,593,507, issued on March 31, was assigned to TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY Co. LTD. (Shenzhen, China).

"Substrate, manufacturing method thereof, and spliced panel" was invented by Hu Wang (Shenzhen, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate, a manufacturing method thereof, and a spliced panel are disclosed. A base includes a front surface, a lateral surface, and a back surface. A first conductive layer is disposed on the front surface. The first conductive layer includes a first wire. A protective layer is disposed on the first conductive layer. A conductive part is correspondingly disposed in a contact hole and is co...