ALEXANDRIA, Va., May 12 -- United States Patent no. 12,624,193, issued on May 12, was assigned to TBM Co. LTD. (Tokyo).
"Biodegradable resin composition and molded product" was invented by Hiroshi Nakamura (Tokyo), Eiji Mizuno (Tokyo) and Gouki Sasakawa (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a biodegradable resin composition that exhibits excellent biodegradability even in a molded product having a large thickness, has excellent mechanical properties, and is economically advantageous, and a molded product using the same. The molded product is provided using an inorganic substance powder-containing biodegradable resin composition including: a biodegradable resin and an inorganic sub...