US Patent Issued to Taiyo Yuden on May 19 for "Electronic component and manufacturing method of electronic component incorporated substrate" (Japanese Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,075, issued on May 19, was assigned to Taiyo Yuden Co. Ltd. (Tokyo).

"Electronic component and manufacturing method of electronic component incorporated substrate" was invented by Takayuki Arai (Tokyo) and Tomoo Kashiwa (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is an electronic component including a base body, a first internal element, a first external electrode, and a second external electrode. The first external electrode has a first outer metal layer and a first inner metal layer that is provided between the first outer metal layer and the first internal element, the second external electrode has a second outer metal layer and...