ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,655, issued on Aug. 4, was assigned to TAIYO HOLDINGS Co. LTD. (Hiki-gun, Japan).
"Structure body and wiring board" was invented by Shoya Sekiguchi (Hiki-gun, Japan), Shoko Mishima (Hiki-gun, Japan), Yuya Fukata (Hiki-gun, Japan) and Nobuhiro Ishikawa (Hiki-gun, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A structure body, including: an insulator, and a conductor layer provided on a surface of at least a portion of the insulator, where: the insulator includes a resin and a filler, and at least one conductor layer component of the conductor layer is present between at least one of the filler and the resin from an interface between the insulat...