US Patent Issued to TAIWAN UNION TECHNOLOGY on July 28 for "Copper clad laminate and uses of the same" (Taiwanese Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,386, issued on July 28, was assigned to TAIWAN UNION TECHNOLOGY Corp. (Zhubei City, Taiwan).

"Copper clad laminate and uses of the same" was invented by Jui-Hsiang Tang (Zhubei City, Taiwan) and Yun Hsing Sung (Zhubei City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A copper clad laminate is provided. The copper clad laminate includes a dielectric layer; an adhesive layer, which is disposed on at least one side of the dielectric layer and formed of an adhesive material, wherein the adhesive material includes a non-perfluorinated resin; and a copper foil, wherein the copper foil has a first surface and is disposed on the other side of the ...