US Patent Issued to Taiwan Semicondutor Manufacturing on Aug. 11 for "Semiconductor package and method of fabricating the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,708,029, issued on Aug. 11, was assigned to Taiwan Semicondutor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor package and method of fabricating the same" was invented by Chen Chen (New Taipei City, Taiwan), Yu-Hung Lin (Taichung City, Taiwan), Chih-Hao Yu (Tainan City, Taiwan), Wei-Ming Wang (Taichung City, Taiwan), Chia-Hui Lin (Taichung County, Taiwan) and Shih-Peng Tai (Hsinchu County, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a photonic integrated circuit (PIC) die having a photonic layer, and an electronic integrated circuit (EIC) die bonded to the PIC die. The EIC die includes an optical regi...