US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Sept. 8 for "Semiconductor system with an integrated wafer humidity control device" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,431, issued on Sept. 8, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD (Hsinchu, Taiwan).

"Semiconductor system with an integrated wafer humidity control device" was invented by Cheng-Lung Wu (Miaoli County, Taiwan), Yi-Fam Shiu (Miaoli County, Taiwan), Yang-Ann Chu (Hsinchu City, Taiwan) and Hsu-Shui Liu (Pingjhen City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure provides an embodiment of a semiconductor fabrication system. The semiconductor fabrication system includes an equipment front end module with a load port to transfer semiconductor wafers to the equipment front end module from a wafer carrie...