US Patent Issued to Taiwan Semiconductor Manufacturing on Sept. 8 for "Package structure and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,507, issued on Sept. 8, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Package structure and manufacturing method thereof" was invented by Chung-Hao Tsai (Changhua County, Taiwan), Tzu-Chun Tang (Kaohsiung City, Taiwan), Chuei-Tang Wang (Taichung City, Taiwan) and Chen-Hua Yu (Hsinchu City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A manufacturing method of a package structure includes: providing a carrier substrate with an integrated circuit (IC) die, where the IC die is disposed in a cavity of the carrier substrate, and a thermally conductive layer is formed in the cavity to separate the IC die from the...