US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Sept. 8 for "Metal structures with seams" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,468, issued on Sept. 8, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Metal structures with seams" was invented by Hao Yang (New Taipei City, Taiwan), Sung-Hsun Wu (Kaohsiung, Taiwan), Neng-Jye Yang (Hsinchu, Taiwan) and Jye-Yen Cheng (Taichung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Devices with metal structures formed with seams and methods of fabrication are provided. An exemplary method includes forming a metal plug having a top surface formed with a seam; depositing a film over the top surface of the metal plug and at least partially filling the seam; and etching the film from over the metal ...