US Patent Issued to Taiwan Semiconductor Manufacturing on Sept. 8 for "Integrated circuit package and method of forming thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,533, issued on Sept. 8, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Integrated circuit package and method of forming thereof" was invented by Hsien-Wei Chen (Hsinchu, Taiwan), Ming-Fa Chen (Taichung, Taiwan) and Ying-Ju Chen (Tuku Township, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a redistribution structure, a first device and a second device attached to the redistribution structure, the first device including: a first die, a support substrate bonded to a first surface of the first die, and a second die bonded to a second surface of the first die opposite the first sur...