US Patent Issued to Taiwan Semiconductor Manufacturing on Sept. 8 for "Die stacking structure, semiconductor package and manufacturing method of the die stacking structure" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,538, issued on Sept. 8, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Die stacking structure, semiconductor package and manufacturing method of the die stacking structure" was invented by Su-Chun Yang (Hsinchu County, Taiwan), Jih-Churng Twu (Hsinchu County, Taiwan), Jiung Wu (Taoyuan City, Taiwan), Chih-Hang Tung (Hsinchu, Taiwan) and Chen-Hua Yu (Hsinchu City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A die stacking structure, a semiconductor package and a method for manufacturing the die stacking structure are provided. The die stacking structure includes a first device die; second device dies, bonded...