US Patent Issued to Taiwan Semiconductor Manufacturing on Sept. 8 for "Alignment mark via assemblies for a composite interposer and methods of using the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,509, issued on Sept. 8, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Alignment mark via assemblies for a composite interposer and methods of using the same" was invented by Wei-An Tsao (Yuanlin Township, Taiwan), Yu-Hsiang Hu (Hsinchu City, Taiwan), Po-Han Wang (Hsinchu City, Taiwan) and Hung-Jui Kuo (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of forming a semiconductor structure is provided, which includes forming via structures over a first carrier wafer. A unit via assembly structure is repeated in two directions over the first carrier wafer. Each instance of the unit via assembly is...