US Patent Issued to Taiwan Semiconductor Manufacturing on Sept. 29 for "Methods of forming an abrasive slurry and methods for chemical-mechanical polishing" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,746,637, issued on Sept. 29, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Methods of forming an abrasive slurry and methods for chemical-mechanical polishing" was invented by Sheng-Mu You (Zhunan City, Taiwan) and Chi-Jen Liu (Taipei City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of performing a polishing process is provided. The method may include forming spherical titanium dioxide nano-particles, covering the spherical titanium dioxide nano-particles with an organic coating, storing the spherical titanium dioxide nano-particles together with an oxidizer, forming a polishing solution with the sp...