US Patent Issued to Taiwan Semiconductor Manufacturing on Sept. 29 for "Composite spring structure to reinforce mechanical robustness of a mems device" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,747,153, issued on Sept. 29, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Composite spring structure to reinforce mechanical robustness of a mems device" was invented by Kuei-Sung Chang (Kaohsiung City, Taiwan), Shang-Ying Tsai (Pingzhen City, Taiwan) and Wei-Jhih Mao (Taipei City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Various embodiments of the present disclosure are directed towards a semiconductor structure comprising a spring structure. A first substrate underlies a second substrate. The first and second substrates at least partially define a cavity. A microelectromechanical systems (MEMS) componen...