US Patent Issued to Taiwan Semiconductor Manufacturing on Sept. 29 for "Anchor-containing underfill structures for a chip package and methods of forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,751,304, issued on Sept. 29, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Anchor-containing underfill structures for a chip package and methods of forming the same" was invented by Chin-Hua Wang (New Taipei City, Taiwan), Yu-Fan Chen (Hsinchu City, Taiwan), Yu Chen Lee (Hsinchu City, Taiwan) and Shin-Puu Jeng (Po-Shan Village, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A bonded assembly includes an interposer including redistribution wiring interconnects and redistribution insulating layers and including recesses in corner regions. The recesses include surfaces that are recessed relative to a horizontal pla...