US Patent Issued to Taiwan Semiconductor Manufacturing on Sept. 22 for "Semiconductor structure with integrated passive device having opposed solder bumps" (Taiwanese, American Inventors)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,672, issued on Sept. 22, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor structure with integrated passive device having opposed solder bumps" was invented by Fong-yuan Chang (Hsinchu County, Taiwan), Ho Che Yu (Zhubei City, Taiwan), Yu-Hao Chen (Hsinchu City, Taiwan), Yii-Chian Lu (Taipei, Taiwan), Ching-Yi Lin (Zhubei City, Taiwan) and Jyh Chwen Frank Lee (Palo Alto, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes an integrated passive device coupled to a redistribution structure by a plurality of first bumps, and having a plurality of second bumps disposed opposi...