US Patent Issued to Taiwan Semiconductor Manufacturing on Sept. 22 for "Probe head for loopback testing and methods of forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,742,795, issued on Sept. 22, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Probe head for loopback testing and methods of forming the same" was invented by Tsai-Ning Lu (Hsinchu, Taiwan), Kuan Chun Chen (Hsinchu City, Taiwan), Guang-Sing Huang (Hsinchu, Taiwan), Yu-Hsuan Cheng (Hsinchu City, Taiwan) and Shu An Shang (Kaohsiung City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A probe card for a circuit probe test system and methods of fabrication thereof. The probe card includes a substrate portion, and a probe head including a guide plate located below the substrate portion and having a plurality of openings...