US Patent Issued to Taiwan Semiconductor Manufacturing on Sept. 22 for "Multi-pattern in-pad surface for polish rate control" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,741,357, issued on Sept. 22, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Multi-pattern in-pad surface for polish rate control" was invented by Hau-Yi Hsiao (Chiayi City, Taiwan), Kuo-Ming Wu (Zhubei City, Taiwan) and Sheng-Chau Chen (Tainan City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Some implementations herein describe a chemical-mechanical planarization tool including a polishing pad. The chemical-mechanical planarization tool including the polishing pad may perform a polishing operation to a semiconductor substrate. The polishing operation may generate, along a perimeter of the semiconductor substr...