US Patent Issued to Taiwan Semiconductor Manufacturing on Sept. 22 for "Integrated circuit packages and methods of forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,645, issued on Sept. 22, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Integrated circuit packages and methods of forming the same" was invented by Hsien-Wei Chen (Hsinchu, Taiwan), Chieh-Lung Lai (Taichung City, Taiwan), Meng-Liang Lin (Hsinchu, Taiwan), Chun-Yueh Yang (Taipei City, Taiwan) and Shin-Puu Jeng (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An integrated circuit package includes an interposer, the interposer including: a first redistribution layer, a second redistribution layer over the first redistribution layer in a central region of the interposer, a dielectric layer over the firs...