US Patent Issued to Taiwan Semiconductor Manufacturing on Sept. 15 for "Interconnect structures, packaged semiconductor devices, and methods of packaging semiconductor devices" (Taiwanese Inventor)

ALEXANDRIA, Va., Sept. 15 -- United States Patent no. 12,737,522, issued on Sept. 15, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Interconnect structures, packaged semiconductor devices, and methods of packaging semiconductor devices" was invented by Hsien-Wei Chen (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Interconnect structures, packaged semiconductor devices, and methods of packaging semiconductor devices are disclosed. In some embodiments, an interconnect structure includes dielectric layers, a conductive layer disposed in the dielectric layers, and a via layer disposed in the dielectric layers proximate the conductive layer. An underball metalliz...