US Patent Issued to Taiwan Semiconductor Manufacturing on Sept. 15 for "Interconnect structure and method of forming same" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 15 -- United States Patent no. 12,734,368, issued on Sept. 15, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsin-Chu, Taiwan).

"Interconnect structure and method of forming same" was invented by Shu-Ting Tsai (Kaohsiung City, Taiwan), Jeng-Shyan Lin (Tainan City, Taiwan), Chun-Chieh Chuang (Tainan City, Taiwan), Dun-Nian Yaung (Taipei City, Taiwan), Jen-Cheng Liu (Hsinchu, Taiwan) and Feng-Chi Hung (Chubei City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device comprises a first chip bonded on a second chip. The first chip comprises a first substrate and first interconnection components formed in first IMD layers. The second chip comprises a s...