US Patent Issued to Taiwan Semiconductor Manufacturing on Sept. 1 for "Three dimensional semiconductor device with memory stack" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,171, issued on Sept. 1, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Three dimensional semiconductor device with memory stack" was invented by Chenchen Wang (Hsinchu, Taiwan), Chun-Chieh Lu (Taipei City, Taiwan), Chi On Chui (Hsinchu, Taiwan), Yu-Ming Lin (Hsinchu, Taiwan) and Sai-Hooi Yeong (Zhubei City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A device includes a first transistor over a substrate, a second transistor disposed over the first transistor, and a memory element disposed over the second transistor. The second transistor includes a channel layer, a gate dielectric layer surrounding a sidewa...