US Patent Issued to Taiwan Semiconductor Manufacturing on Sept. 1 for "Semiconductor device and method of manufacturing" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,454, issued on Sept. 1, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor device and method of manufacturing" was invented by Chung-Ting Ko (Kaohsiung City, Taiwan), Yu-Cheng Shiau (Hsinchu, Taiwan), Li-Jung Kuo (Zhubei City, Taiwan), Sung-En Lin (Xionglin Township, Taiwan) and Kuo-Chin Liu (Ji-an Township, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device and method of manufacture are provided. In some embodiments isolation regions are formed by modifying a dielectric material of a dielectric layer such that a first portion of the dielectric layer is more readily removed by an e...