US Patent Issued to Taiwan Semiconductor Manufacturing on Sept. 1 for "Photonic silicon-insulator-silicon modulator and methods for forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,724,196, issued on Sept. 1, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Photonic silicon-insulator-silicon modulator and methods for forming the same" was invented by Chun-Heng Liao (Xindian City, Taiwan), Jiun Yi Wu (Zhongli City, Taiwan), Kuo-Chung Yee (Taoyuan City, Taiwan) and Li-Weng Chang (Sanxia Township, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An embodiment photonic device may include a first terminal including silicon and a waveguide structure optically connected with the first terminal, a cladding dielectric layer formed around the first terminal including the waveguide structure, a second term...