US Patent Issued to Taiwan Semiconductor Manufacturing on Sept. 1 for "Method of fabricating package structure" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,522, issued on Sept. 1, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Method of fabricating package structure" was invented by Wen-Wei Shen (Hsinchu, Taiwan), Sung-Hui Huang (Yilan County, Taiwan) and Shang-Yun Hou (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package structure includes a circuit substrate and a semiconductor device. The semiconductor device is disposed on and electrically connected to the circuit substrate. The semiconductor device includes an interconnection structure, a semiconductor die, an insulating encapsulant, a protection layer and electrical connectors. The interconnect...