US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Sept. 1 for "Heat sink structure and methods thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,121, issued on Sept. 1, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Heat sink structure and methods thereof" was invented by Chien Hao Hsu (Hsinchu County, Taiwan), Kuo-Chin Chang (Chiayi City, Taiwan), Kathy Wei Yan (Hsinchu, Taiwan) and Jun He (Hsinchu County, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "One aspect of the present disclosure pertains to an integrated circuit (IC) structure. The IC structure includes a die and an integrated heat sink structure disposed over the die. In some embodiments, the integrated heat sink structure includes a first closed-loop microchannel structure adjacent to ...