US Patent Issued to Taiwan Semiconductor Manufacturing on Sept. 1 for "Backside illumination imaging sensor and methods of manufacturing" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,263, issued on Sept. 1, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Backside illumination imaging sensor and methods of manufacturing" was invented by Yu-Wei Huang (Tainan City, Taiwan), Chen-Hsien Lin (Tainan City, Taiwan), Yu-Ting Chen (Wanluan Township, Taiwan), Shu-Ting Tsai (Kaohsiung City, Taiwan) and Tzu-Hsuan Hsu (Kaohsiung City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Some implementations described herein provide for techniques to form a biased backside deep trench isolation and grid structure for a backside illumination image sensor. The techniques include forming an array of backside deep ...