US Patent Issued to Taiwan Semiconductor Manufacturing on Oct. 6 for "Shielding for reducing electromagnetic interference and magnetic interference and methods for forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,737, issued on Oct. 6, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Shielding for reducing electromagnetic interference and magnetic interference and methods for forming the same" was invented by Harry-Hak-Lay Chuang (Zhubei city, Taiwan), Yuan-Jen Lee (Hsinchu, Taiwan), Kuo-An Liu (Hsinchu City, Taiwan), Ching-Huang Wang (Pingjhen City, Taiwan), C.T. Kuo (Hsinchu City, Taiwan) and Tien-Wei Chiang (Taipei City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Devices and method for forming a shielding assembly including a first chip package structure sensitive to magnetic interference (MI), a second chip packag...