US Patent Issued to Taiwan Semiconductor Manufacturing on Oct. 6 for "Semiconductor package and manufacturing method of semiconductor package" (Taiwanese Inventors)

ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,758, issued on Oct. 6, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor package and manufacturing method of semiconductor package" was invented by Ying-Cheng Tseng (Tainan City, Taiwan), Hao-Yi Tsai (Hsinchu City, Taiwan), Yu-Chih Huang (Hsinchu, Taiwan) and Chia-Hung Liu (Hsinchu City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a lower encapsulated semiconductor device, a lower redistribution structure, an upper encapsulated semiconductor device, and an upper redistribution structure. The lower redistribution structure is disposed over and electrically connected...