US Patent Issued to Taiwan Semiconductor Manufacturing on Oct. 6 for "Package structures and methods of manufacturing the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,734, issued on Oct. 6, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Package structures and methods of manufacturing the same" was invented by Yu-Chia Lai (Miaoli County, Taiwan), Chen-Hua Yu (Hsinchu City, Taiwan), Chung-Shi Liu (Hsinchu City, Taiwan), Hao-Yi Tsai (Hsinchu City, Taiwan), Kuo-Chung Yee (Taoyuan City, Taiwan) and Tin-Hao Kuo (Hsinchu City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package structure includes a first die, an encapsulant and a securing element. The encapsulant encapsulates the first die. The securing element penetrates through the encapsulant and a corner of the first die a...