US Patent Issued to Taiwan Semiconductor Manufacturing on Oct. 6 for "Optical thickness control during a chemical mechanical polishing process and apparatus for effecting the same" (Taiwanese Inventor)

ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,752,390, issued on Oct. 6, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Optical thickness control during a chemical mechanical polishing process and apparatus for effecting the same" was invented by Chun-Hsi Huang (Hsinchu City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate may be loaded onto a chemical mechanical polishing (CMP) apparatus, which includes a polishing pad and a wafer carrier that holds the substrate. The wafer carrier includes a backside plate, a wafer carrier frame, and at least one optical vertical displacement measurement unit that includes a respective laser source and a respectiv...