US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Oct. 6 for "Method of manufacturing semiconductor packages" (Taiwanese Inventors)

ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,759, issued on Oct. 6, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Method of manufacturing semiconductor packages" was invented by Li-Ling Liao (Hsinchu City, Taiwan), Ming-Chih Yew (Hsinchu City, Taiwan), Chia-Kuei Hsu (Hsinchu City, Taiwan) and Shin-Puu Jeng (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package structure includes an interposer, a die, a conductive terminal and an interconnection structure that is disposed on a first side of the interposer. The die is electrically bonded to the interposer and disposed over the interconnection structure. The conductive terminal is connected ...