US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Oct. 27 for "Semiconductor structure and method for forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,670, issued on Oct. 27, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Semiconductor structure and method for forming the same" was invented by Da-Zhi Zhang (Hsinchu, Taiwan), Chun-An Lu (Hsinchu County, Taiwan), Chung-Yu Chiang (Yuanlin Township, Changhua County, Taiwan), Po-Nien Chen (Miaoli County, Taiwan), Hsiao-Han Liu (Miaoli County, Taiwan), Jhon-Jhy Liaw (Zhudong Township, Hsinchu County, Taiwan) and Chih-Yung Lin (Hsinchu County, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for forming a semiconductor structure is provided. The method for forming the semiconductor structure includes for...