US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Oct. 27 for "Semiconductor package with stiffener structure" (Taiwanese Inventors)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,963, issued on Oct. 27, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Semiconductor package with stiffener structure" was invented by Chieh-Ming Chang (New Taipei City, Taiwan), Chia-Kuei Hsu (Hsinchu City, Taiwan), Ming-Chih Yew (Hsinchu City, Taiwan) and Shin-Puu Jeng (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A chip package structure is provided. The chip package structure includes a semiconductor die formed over a package substrate and an interconnect structure bonded and electrically connected between the semiconductor die and the package substrate. The chip package structure also inclu...