US Patent Issued to Taiwan Semiconductor Manufacturing on Oct. 27 for "Semiconductor devices and methods of manufacture" (Taiwanese Inventors)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,774,207, issued on Oct. 27, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor devices and methods of manufacture" was invented by Yun-Chung Wu (Taipei City, Taiwan), Jhao-Yi Wang (Tainan, Taiwan), Hao Chun Yang (New Taipei City, Taiwan), Pei-Wei Lee (Kaohsiung City, Taiwan) and Wen-Hsiung Lu (Tainan City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Microelectromechanical devices and methods of manufacture are presented. Embodiments include bonding a mask substrate to a first microelectromechanical system (MEMS) device. After the bonding has been performed, the mask substrate is patterned. A first con...