US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Oct. 27 for "Semiconductor device and method" (Taiwanese Inventors)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,978, issued on Oct. 27, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Semiconductor device and method" was invented by Ke-Gang Wen (Hsinchu, Taiwan), Yu-Bey Wu (Hsinchu, Taiwan), Liang-Wei Wang (Hsinchu, Taiwan), Hsin-Feng Chen (Yilan City, Taiwan), Tsung-Chieh Hsiao (Shetou Township, Taiwan), Chih Chuan Su (Hsinchu, Taiwan) and Dian-Hau Chen (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An embodiment is a device including a first die and a substrate including a first surface and a second surface opposite the first surface. The device also includes an active device on the first surface of the s...