ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,984, issued on Oct. 27, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).
"Photonic semiconductor device and method of manufacture" was invented by Chen-Hua Yu (Hsinchu, Taiwan) and Hsing-Kuo Hsia (Jhubei City, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A package includes an interposer structure including a first via; a first interconnect device including conductive routing and which is free of active devices; an encapsulant surrounding the first via and the first interconnect device; and a first interconnect structure over the encapsulant and connected to the first via and the first interconnect device; a fir...