US Patent Issued to Taiwan Semiconductor Manufacturing on Oct. 27 for "Package structure with connecting structure and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,951, issued on Oct. 27, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Package structure with connecting structure and manufacturing method thereof" was invented by Chen-Hsuan Tsai (Taitung City, Taiwan), Yu-Lin Chiang (Hsinchu, Taiwan), Chin-Chuan Chang (Hsinchu County, Taiwan) and Ying-Ching Shih (Hsinchu City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package structure includes a first redistribution circuit structure, a first semiconductor die, and a second semiconductor die. The first redistribution circuit structure has a first side and a second side opposite to the first side. The first semicondu...