US Patent Issued to Taiwan Semiconductor Manufacturing on Oct. 27 for "Microelectromechanical device and method for making the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,774,206, issued on Oct. 27, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Microelectromechanical device and method for making the same" was invented by Shih-Yu Liao (Hsinchu City, Taiwan) and Tsai-Hao Hung (Hsinchu City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A microdevice including a first pedestal, a second pedestal parallel to the first pedestal, the second pedestal comprising a first protrusion on its top surface. The device also including a conformal dielectric layer and a metal structure formed over a portion of the conformal dielectric layer. The metal structure including a first portion surroundin...