US Patent Issued to Taiwan Semiconductor Manufacturing on Oct. 27 for "Method of manufacturing a semiconductor device including patterning a semiconductor substrate to form openings" (Taiwanese Inventors)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,687, issued on Oct. 27, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Method of manufacturing a semiconductor device including patterning a semiconductor substrate to form openings" was invented by Fu Wei Liu (Tainan, Taiwan), Pei-Wei Lee (Kaohsiung City, Taiwan), Yun-Chung Wu (Taipei City, Taiwan), Bo-Yu Chiu (Taoyuan City, Taiwan), Szu-Hsien Lee (Tainan City, Taiwan) and Mirng-Ji Lii (Sinpu Township, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Semiconductor devices and methods of manufacturing the semiconductor devices are presented. In embodiments the methods of manufacturing include depositing a first ...