US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Oct. 27 for "Method and structure for semiconductor interconnect" (Taiwanese, American Inventors)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,872, issued on Oct. 27, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING Co. LTD. (Hsinchu, Taiwan).

"Method and structure for semiconductor interconnect" was invented by Ru-Shang Hsiao (Hsinchu County, Taiwan), Chun Hsiung Tsai (Hsinchu County, Taiwan) and Clement Hsingjen Wann (Carmel, N.Y.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor structure includes a substrate, a conductive feature over the substrate, a dielectric layer over the conductive feature and the substrate, and a structure disposed over and electrically connected to the conductive feature. The structure is partially surrounded by the dielectric layer and includes ...