US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Oct. 27 for "Integrated circuit device and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,681, issued on Oct. 27, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Integrated circuit device and manufacturing method thereof" was invented by Yi-Ruei Jhan (Keelung City, Taiwan), Kuan-Ting Pan (Taipei City, Taiwan), Wei Ting Wang (Taipei City, Taiwan), Shi Ning Ju (Hsinchu City, Taiwan), Kuo-Cheng Chiang (Hsinchu County, Taiwan) and Chih-Hao Wang (Hsinchu County, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of manufacturing an integrated circuit device is provided. The method includes forming a semiconductor fin over a semiconductor substrate; forming an isolation structure surrounding the ...