US Patent Issued to Taiwan Semiconductor Manufacturing on Oct. 27 for "By-site-compensated etch back for local planarization/topography adjustment" (Taiwanese Inventors)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,857, issued on Oct. 27, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"By-site-compensated etch back for local planarization/topography adjustment" was invented by Ming Chyi Liu (Hsinchu City, Taiwan), Hung-Wen Hsu (Tainan City, Taiwan) and Min-Yung Ko (Hsinchu City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A work piece is positioned on a work piece support, which includes a plurality of temperature control zones. A pre-etch surface topography is determined by measuring a plurality of pre-etch surface heights or thicknesses at a plurality of sites on the work piece. The plurality of sites correspond to t...